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Date: Mon, 13 Jun 2016 11:20:22 +0100
From: Bruce Richardson <bruce.richardson@intel.com>
To: Declan Doherty <declan.doherty@intel.com>
Cc: dev@dpdk.org
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Subject: Re: [dpdk-dev] [PATCH v2 0/2] bond mode 4 external sm api
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On Fri, May 27, 2016 at 12:44:04PM -0700, Eric Kinzie wrote:

Ping for review. Maintainer, any comments?

> This patchset introduces the ability to use an external 802.3ad state
> machine for mode 4 bonding.  Functions to alter the mux state and to
> allow LACPDUs to be sent and received from outside of the bonding PMD
> are provided.
> 
> v2 changes:
>   . fix checkpatch errors
> 
> Eric Kinzie (2):
>   bond mode 4: allow external state machine
>   bond mode 4: tests for external state machine
> 
>  app/test/test_link_bonding_mode4.c                |  215 +++++++++++++-
>  drivers/net/bonding/rte_eth_bond_8023ad.c         |  323 +++++++++++++++++++--
>  drivers/net/bonding/rte_eth_bond_8023ad.h         |   83 ++++++
>  drivers/net/bonding/rte_eth_bond_8023ad_private.h |   14 +-
>  drivers/net/bonding/rte_eth_bond_version.map      |   16 +
>  5 files changed, 610 insertions(+), 41 deletions(-)
> 
> -- 
> 1.7.10.4
>