From: Jay Rolette <rolette@infinite.io>
To: Stephen Hemminger <stephen@networkplumber.org>
Cc: Chas Williams <chas3@att.com>,
"Wei Hu (Xavier)" <xavier.huwei@huawei.com>, DPDK <dev@dpdk.org>
Subject: Re: [dpdk-dev] Aligning DPDK Link bonding with current standards terminology
Date: Tue, 16 Jun 2020 06:48:30 -0500 [thread overview]
Message-ID: <CADNuJVokhhg-YvWE6RDovYqvO9Out5FL2PbPyFyhLeeQTm7m=Q@mail.gmail.com> (raw)
In-Reply-To: <20200615155237.682a89af@hermes.lan>
On Mon, Jun 15, 2020 at 5:52 PM Stephen Hemminger <
stephen@networkplumber.org> wrote:
> I am disturbed by the wide spread use of master/slave in Ethernet bonding.
> Asked the current IEEE chairs and it looks like it is already fixed
> "upstream".
>
> The proper terminology is for Ethernet link aggregation in the
> the current standard 802.1AX 2020 revision (pay walled) for the parts
> formerly known as master and slave is now "Protocol Parser" and "Protocol
> multiplexer".
>
> Also it is not called bonding anywhere; it uses LACP only.
>
LACP is only 1 of 5 bonding modes.
> Given the large scope of the name changes. Maybe it would be best to just
> convert the names
> all of rte_eth_bond to rte_eth_lacp and fix the master/slave references at
> the same time.
>
Why rename rte_eth_bond at all?
> For one brief release (20.08) keep both drivers and mark the bond on as
> deprecated.
> It would also help if all the documentation and tests were checked to see
> if they
> align with the current standard.
>
The current naming appears to be a straight copy of the Linux naming + a
prefix change.
next prev parent reply other threads:[~2020-06-16 11:48 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2020-06-15 22:52 Stephen Hemminger
2020-06-16 10:03 ` Chas Williams
2020-06-16 11:48 ` Jay Rolette [this message]
2020-06-16 13:52 ` Chas Williams
2020-06-16 15:45 ` Stephen Hemminger
2020-06-16 20:27 ` Chas Williams
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