From: "Li, Xiaoyun" <xiaoyun.li@intel.com>
To: "Min Hu (Connor)" <humin29@huawei.com>, "dev@dpdk.org" <dev@dpdk.org>
Cc: "Yigit, Ferruh" <ferruh.yigit@intel.com>
Subject: Re: [dpdk-dev] [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
Date: Mon, 11 Oct 2021 08:17:25 +0000 [thread overview]
Message-ID: <DM4PR11MB5534C42FD4C7B5E0A995B96399B59@DM4PR11MB5534.namprd11.prod.outlook.com> (raw)
In-Reply-To: <20210924095720.64398-1-humin29@huawei.com>
> -----Original Message-----
> From: Min Hu (Connor) <humin29@huawei.com>
> Sent: Friday, September 24, 2021 17:57
> To: dev@dpdk.org
> Cc: Yigit, Ferruh <ferruh.yigit@intel.com>; Li, Xiaoyun <xiaoyun.li@intel.com>
> Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
>
> From: Chengchang Tang <tangchengchang@huawei.com>
>
> Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
>
> Show the lacp information about the bonded device and its slaves:
> show bonding lacp info <bonded device port_id>
>
> Signed-off-by: Chengchang Tang <tangchengchang@huawei.com>
> Signed-off-by: Min Hu(Connor) <humin29@huawei.com>
> ---
> v3:
> * fix state show.
>
> v2:
> * same patch with v1.
> ---
> app/test-pmd/cmdline.c | 184 ++++++++++++++++++++
> doc/guides/testpmd_app_ug/testpmd_funcs.rst | 6 +
> 2 files changed, 190 insertions(+)
Acked-by: Xiaoyun Li <xiaoyun.li@intel.com>
next prev parent reply other threads:[~2021-10-11 8:17 UTC|newest]
Thread overview: 7+ messages / expand[flat|nested] mbox.gz Atom feed top
2021-09-22 6:24 [dpdk-dev] [PATCH] " Min Hu (Connor)
2021-09-23 3:20 ` Li, Xiaoyun
2021-09-24 9:18 ` Min Hu (Connor)
2021-09-24 9:48 ` [dpdk-dev] [PATCH v2] " Min Hu (Connor)
2021-09-24 9:57 ` [dpdk-dev] [PATCH v3] " Min Hu (Connor)
2021-10-11 8:17 ` Li, Xiaoyun [this message]
2021-10-11 14:19 ` Ferruh Yigit
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