From: Ferruh Yigit <ferruh.yigit@intel.com>
To: "Li, Xiaoyun" <xiaoyun.li@intel.com>,
"Min Hu (Connor)" <humin29@huawei.com>,
"dev@dpdk.org" <dev@dpdk.org>
Subject: Re: [dpdk-dev] [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
Date: Mon, 11 Oct 2021 15:19:35 +0100 [thread overview]
Message-ID: <a6c0eb4f-f6ac-7382-e621-9836787c533d@intel.com> (raw)
In-Reply-To: <DM4PR11MB5534C42FD4C7B5E0A995B96399B59@DM4PR11MB5534.namprd11.prod.outlook.com>
On 10/11/2021 9:17 AM, Li, Xiaoyun wrote:
>> -----Original Message-----
>> From: Min Hu (Connor) <humin29@huawei.com>
>> Sent: Friday, September 24, 2021 17:57
>> To: dev@dpdk.org
>> Cc: Yigit, Ferruh <ferruh.yigit@intel.com>; Li, Xiaoyun <xiaoyun.li@intel.com>
>> Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
>>
>> From: Chengchang Tang <tangchengchang@huawei.com>
>>
>> Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
>>
>> Show the lacp information about the bonded device and its slaves:
>> show bonding lacp info <bonded device port_id>
>>
>> Signed-off-by: Chengchang Tang <tangchengchang@huawei.com>
>> Signed-off-by: Min Hu(Connor) <humin29@huawei.com>
>> ---
>> v3:
>> * fix state show.
>>
>> v2:
>> * same patch with v1.
>> ---
>> app/test-pmd/cmdline.c | 184 ++++++++++++++++++++
>> doc/guides/testpmd_app_ug/testpmd_funcs.rst | 6 +
>> 2 files changed, 190 insertions(+)
>
> Acked-by: Xiaoyun Li <xiaoyun.li@intel.com>
>
Applied to dpdk-next-net/main, thanks.
prev parent reply other threads:[~2021-10-11 14:19 UTC|newest]
Thread overview: 7+ messages / expand[flat|nested] mbox.gz Atom feed top
2021-09-22 6:24 [dpdk-dev] [PATCH] " Min Hu (Connor)
2021-09-23 3:20 ` Li, Xiaoyun
2021-09-24 9:18 ` Min Hu (Connor)
2021-09-24 9:48 ` [dpdk-dev] [PATCH v2] " Min Hu (Connor)
2021-09-24 9:57 ` [dpdk-dev] [PATCH v3] " Min Hu (Connor)
2021-10-11 8:17 ` Li, Xiaoyun
2021-10-11 14:19 ` Ferruh Yigit [this message]
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