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From: bugzilla@dpdk.org
To: dev@dpdk.org
Subject: [DPDK/ethdev Bug 1699] Bonding device documentation missing
Date: Thu, 24 Apr 2025 16:28:58 +0000
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Date: Thu, 24 Apr 2025 18:28:58 +0200
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https://bugs.dpdk.org/show_bug.cgi?id=3D1699
Bug ID: 1699
Summary: Bonding device documentation missing
Product: DPDK
Version: 25.03
Hardware: All
OS: All
Status: UNCONFIRMED
Severity: minor
Priority: Normal
Component: ethdev
Assignee: dev@dpdk.org
Reporter: stephen@networkplumber.org
Target Milestone: ---
There is no entry in the PMD feature matrix for bonding device.
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--17455121380.Df0A.77312
Date: Thu, 24 Apr 2025 18:28:58 +0200
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Bug ID |
1699
|
Summary |
Bonding device documentation missing
|
Product |
DPDK
|
Version |
25.03
|
Hardware |
All
|
OS |
All
|
Status |
UNCONFIRMED
|
Severity |
minor
|
Priority |
Normal
|
Component |
ethdev
|
Assignee |
dev@dpdk.org
|
Reporter |
stephen@networkplumber.org
|
Target Milestone |
---
|
You are receiving this mail because:
- You are the assignee for the bug.
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--17455121380.Df0A.77312--