From: yufengmx <yufengx.mo@intel.com@intel.com>
To: dts@dpdk.org
Cc: yufengmx <yufengx.mo@intel.com@intel.com>
Subject: [dts] [PATCH V2][testpmd/stacked_bonded]: test plan for testpmd stacked bonded stacked bonded mechanism allow a bonded port to be added to another bonded port.
Date: Thu, 31 Jan 2019 14:32:44 +0800 [thread overview]
Message-ID: <1548916365-182758-1-git-send-email-yufengx.mo@intel.com> (raw)
yufengmx (1):
[testpmd/stacked_bonded]: test plan for testpmd stacked bonded
test_plans/pmd_stacked_bonded_test_plan.rst | 408 ++++++++++++++++++++++++++++
1 file changed, 408 insertions(+)
create mode 100644 test_plans/pmd_stacked_bonded_test_plan.rst
--
1.9.3
next reply other threads:[~2019-01-31 6:30 UTC|newest]
Thread overview: 4+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-01-31 6:32 yufengmx [this message]
2019-01-31 6:32 ` [dts] [PATCH V2][testpmd/stacked_bonded]: test plan for testpmd stacked bonded yufengmx
2019-02-01 5:44 ` Chen, Zhaoyan
2019-02-01 5:48 ` Tu, Lijuan
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