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From: "lihuisong (C)" <lihuisong@huawei.com>
To: "humin (Q)" <humin29@huawei.com>,
	Chengwen Feng <fengchengwen@huawei.com>,  <thomas@monjalon.net>,
	<ferruh.yigit@xilinx.com>
Cc: <dev@dpdk.org>, <chas3@att.com>
Subject: Re: [PATCH v2 0/3] net/bonding: support device private dump
Date: Thu, 15 Dec 2022 18:56:53 +0800	[thread overview]
Message-ID: <7c73a379-3775-8138-1fcf-23731f98bb0d@huawei.com> (raw)
In-Reply-To: <83aae131-14f0-72b8-4dac-792abc6bb52f@huawei.com>


在 2022/12/14 17:55, humin (Q) 写道:
> Acked-by:Min Hu (Connor) <humin29@huawei.com>
Indeed, it is better to move them to bonding PMD. lgtm
Series-acked-by: Huisong Li <lihuisong@huawei.com>
>
> 在 2022/12/14 14:13, Chengwen Feng 写道:
>> This patchset adds device private dump for bonding PMD, and use
>> rte_eth_dev_priv_dump API to implement testpmd show bonding command.
>>
>> Chengwen Feng (3):
>>    net/bonding: support private dump ops
>>    net/bonding: support dump LACP info
>>    net/bonding: use dump API to impl show bonding cmd
>>
>> ---
>> v2:
>> * address Min Hu's comment
>> * use rte_eth_dev_priv_dump API to implement testpmd show bonding
>>    command.
>>
>>   .../link_bonding_poll_mode_drv_lib.rst        |  13 +-
>>   drivers/net/bonding/bonding_testpmd.c         | 281 +-----------------
>>   drivers/net/bonding/rte_eth_bond_pmd.c        | 244 ++++++++++++++-
>>   3 files changed, 249 insertions(+), 289 deletions(-)
>>
>
> .

  reply	other threads:[~2022-12-15 10:56 UTC|newest]

Thread overview: 12+ messages / expand[flat|nested]  mbox.gz  Atom feed  top
2022-12-05  8:10 [PATCH 0/2] " Chengwen Feng
2022-12-05  8:10 ` [PATCH 1/2] net/bonding: support private dump ops Chengwen Feng
2022-12-06  2:01   ` humin (Q)
2022-12-14  6:24     ` fengchengwen
2022-12-05  8:10 ` [PATCH 2/2] net/bonding: support dump LACP info Chengwen Feng
2022-12-14  6:13 ` [PATCH v2 0/3] net/bonding: support device private dump Chengwen Feng
2022-12-14  6:13   ` [PATCH v2 1/3] net/bonding: support private dump ops Chengwen Feng
2022-12-14  6:13   ` [PATCH v2 2/3] net/bonding: support dump LACP info Chengwen Feng
2022-12-14  6:13   ` [PATCH v2 3/3] net/bonding: use dump API to impl show bonding cmd Chengwen Feng
2022-12-14  9:55   ` [PATCH v2 0/3] net/bonding: support device private dump humin (Q)
2022-12-15 10:56     ` lihuisong (C) [this message]
2023-01-16 12:34       ` Ferruh Yigit

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