From: Ferruh Yigit <ferruh.yigit@amd.com>
To: Chaoyong He <chaoyong.he@corigine.com>, dev@dpdk.org
Cc: oss-drivers@corigine.com, Long Wu <long.wu@corigine.com>,
James Hershaw <james.hershaw@corigine.com>
Subject: Re: [PATCH v2] net/bonding: rename bonded to bonding
Date: Thu, 21 Sep 2023 11:11:01 +0100 [thread overview]
Message-ID: <a01d6c03-bc72-4a4f-8561-fecfb51a4be4@amd.com> (raw)
In-Reply-To: <20230921061043.1057351-1-chaoyong.he@corigine.com>
On 9/21/2023 7:10 AM, Chaoyong He wrote:
> From: Long Wu <long.wu@corigine.com>
>
> DPDK bonding PMD mixing use 'bonded' and 'bonding' currently, this
> patch replaces the usage of the word 'bonded' with more appropriate
> word 'bonding' in bonding PMD as well as in its docs. Also the test
> app and testpmd were modified to use the new wording.
>
> In addition to grammar requirements, we should still use bonded,
> and in other cases, we should use bonding.
>
> Signed-off-by: Long Wu <long.wu@corigine.com>
> Reviewed-by: Chaoyong He <chaoyong.he@corigine.com>
> Reviewed-by: James Hershaw <james.hershaw@corigine.com>
> ---
> v2:
> * Rebase to the latest commits.
Thanks for the rebase.
Acked-by: Ferruh Yigit <ferruh.yigit@amd.com>
Applied to dpdk-next-net/main, thanks.
<...>
> @@ -505,17 +505,17 @@ Testpmd driver specific commands
>
> Some bonding driver specific features are integrated in testpmd.
>
> -create bonded device
> +create bonding device
> ~~~~~~~~~~~~~~~~~~~~
>
This gives warning, will fix while merging.
link_bonding_poll_mode_drv_lib.rst:509: WARNING: Title underline too short.
prev parent reply other threads:[~2023-09-21 10:11 UTC|newest]
Thread overview: 6+ messages / expand[flat|nested] mbox.gz Atom feed top
2023-05-24 7:12 [PATCH] " Chaoyong He
2023-05-24 14:48 ` Stephen Hemminger
2023-06-02 15:15 ` Ferruh Yigit
2023-06-02 17:04 ` Ferruh Yigit
2023-09-21 6:10 ` [PATCH v2] " Chaoyong He
2023-09-21 10:11 ` Ferruh Yigit [this message]
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