[dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device

[Chengchang Tang <tangchengchang@huawei.com>]

This patch set add Tx prepare for bonding device.

Currently, the bonding driver has not implemented the callback of
rte_eth_tx_prepare function. Therefore, the TX prepare function of the
slave devices will never be invoked. When hardware offloading such as
CKSUM and TSO are enabled for some drivers, tx_prepare needs to be used
to adjust packets (for example, set correct pseudo packet headers).
Otherwise, related offloading fails and even packets are sent
incorrectly. Due to this limitation, the bonded device cannot use these
HW offloading in the Tx direction.

Because packet sending algorithms are numerous and complex in bond PMD,
it is hard to design the callback for rte_eth_tx_prepare. In this
patchset, the tx_prepare callback of bonding PMD is not implemented.
Instead, rte_eth_tx_prepare has been called in tx_burst callback. In
this way, all tx_offloads can be processed correctly for all NIC devices.
It is the responsibility of the slave PMDs to decide when the real
tx_prepare needs to be used. If tx_prepare is not required in some cases,
then slave PMDs tx_prepare pointer should be NULL and rte_eth_tx_prepare()
will be just a NOOP. That is, the effectiveness and security of tx_prepare
and its impact on performance depend on the design of slave PMDs.

And configuring Tx offloading for bonding is also added in this patchset.
This solves the problem that we need to configure slave devices one by one
when configuring Tx offloading.

Chengchang Tang (2):
  net/bonding: support Tx prepare for bonding
  net/bonding: support configuring Tx offloading for bonding

 drivers/net/bonding/rte_eth_bond.h     |  1 -
 drivers/net/bonding/rte_eth_bond_pmd.c | 41 ++++++++++++++++++++++++++++++----
 2 files changed, 37 insertions(+), 5 deletions(-)

--
2.7.4