From: Chengwen Feng <fengchengwen@huawei.com>
To: <thomas@monjalon.net>, <ferruh.yigit@xilinx.com>
Cc: <dev@dpdk.org>, <chas3@att.com>, <humin29@huawei.com>
Subject: [PATCH v2 0/3] net/bonding: support device private dump
Date: Wed, 14 Dec 2022 06:13:22 +0000 [thread overview]
Message-ID: <20221214061325.20272-1-fengchengwen@huawei.com> (raw)
In-Reply-To: <20221205081051.25905-1-fengchengwen@huawei.com>
This patchset adds device private dump for bonding PMD, and use
rte_eth_dev_priv_dump API to implement testpmd show bonding command.
Chengwen Feng (3):
net/bonding: support private dump ops
net/bonding: support dump LACP info
net/bonding: use dump API to impl show bonding cmd
---
v2:
* address Min Hu's comment
* use rte_eth_dev_priv_dump API to implement testpmd show bonding
command.
.../link_bonding_poll_mode_drv_lib.rst | 13 +-
drivers/net/bonding/bonding_testpmd.c | 281 +-----------------
drivers/net/bonding/rte_eth_bond_pmd.c | 244 ++++++++++++++-
3 files changed, 249 insertions(+), 289 deletions(-)
--
2.17.1
next prev parent reply other threads:[~2022-12-14 6:20 UTC|newest]
Thread overview: 12+ messages / expand[flat|nested] mbox.gz Atom feed top
2022-12-05 8:10 [PATCH 0/2] " Chengwen Feng
2022-12-05 8:10 ` [PATCH 1/2] net/bonding: support private dump ops Chengwen Feng
2022-12-06 2:01 ` humin (Q)
2022-12-14 6:24 ` fengchengwen
2022-12-05 8:10 ` [PATCH 2/2] net/bonding: support dump LACP info Chengwen Feng
2022-12-14 6:13 ` Chengwen Feng [this message]
2022-12-14 6:13 ` [PATCH v2 1/3] net/bonding: support private dump ops Chengwen Feng
2022-12-14 6:13 ` [PATCH v2 2/3] net/bonding: support dump LACP info Chengwen Feng
2022-12-14 6:13 ` [PATCH v2 3/3] net/bonding: use dump API to impl show bonding cmd Chengwen Feng
2022-12-14 9:55 ` [PATCH v2 0/3] net/bonding: support device private dump humin (Q)
2022-12-15 10:56 ` lihuisong (C)
2023-01-16 12:34 ` Ferruh Yigit
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