Re: [dpdk-dev] [PATCH 0/2] add Tx prepare support for bonding device

[Chengchang Tang <tangchengchang@huawei.com>]

Hi，all
Any comments？

On 2021/4/23 17:46, Chengchang Tang wrote:
> This patch set add Tx prepare for bonding device.
> 
> Currently, the bonding driver has not implemented the callback of
> rte_eth_tx_prepare function. Therefore, the TX prepare function of the
> slave devices will never be invoked. When hardware offloading such as
> CKSUM and TSO are enabled for some drivers, tx_prepare needs to be used
> to adjust packets (for example, set correct pseudo packet headers).
> Otherwise, related offloading fails and even packets are sent
> incorrectly. Due to this limitation, the bonded device cannot use these
> HW offloading in the Tx direction.
> 
> Because packet sending algorithms are numerous and complex in bond PMD,
> it is hard to design the callback for rte_eth_tx_prepare. In this
> patchset, the tx_prepare callback of bonding PMD is not implemented.
> Instead, rte_eth_tx_prepare has been called in tx_burst callback. In
> this way, all tx_offloads can be processed correctly for all NIC devices.
> It is the responsibility of the slave PMDs to decide when the real
> tx_prepare needs to be used. If tx_prepare is not required in some cases,
> then slave PMDs tx_prepare pointer should be NULL and rte_eth_tx_prepare()
> will be just a NOOP. That is, the effectiveness and security of tx_prepare
> and its impact on performance depend on the design of slave PMDs.
> 
> And configuring Tx offloading for bonding is also added in this patchset.
> This solves the problem that we need to configure slave devices one by one
> when configuring Tx offloading.
> 
> Chengchang Tang (2):
>   net/bonding: support Tx prepare for bonding
>   net/bonding: support configuring Tx offloading for bonding
> 
>  drivers/net/bonding/rte_eth_bond.h     |  1 -
>  drivers/net/bonding/rte_eth_bond_pmd.c | 41 ++++++++++++++++++++++++++++++----
>  2 files changed, 37 insertions(+), 5 deletions(-)
> 
> --
> 2.7.4
> 
> 
> .
>