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Subject: Re: [PATCH v2 0/3] net/bonding: support device private dump
To: "humin (Q)" <humin29@huawei.com>, Chengwen Feng <fengchengwen@huawei.com>, 
 <thomas@monjalon.net>, <ferruh.yigit@xilinx.com>
CC: <dev@dpdk.org>, <chas3@att.com>
References: <20221205081051.25905-1-fengchengwen@huawei.com>
 <20221214061325.20272-1-fengchengwen@huawei.com>
 <83aae131-14f0-72b8-4dac-792abc6bb52f@huawei.com>
From: "lihuisong (C)" <lihuisong@huawei.com>
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在 2022/12/14 17:55, humin (Q) 写道:
> Acked-by：Min Hu (Connor) <humin29@huawei.com>
Indeed, it is better to move them to bonding PMD. lgtm
Series-acked-by: Huisong Li <lihuisong@huawei.com>
>
> 在 2022/12/14 14:13, Chengwen Feng 写道:
>> This patchset adds device private dump for bonding PMD, and use
>> rte_eth_dev_priv_dump API to implement testpmd show bonding command.
>>
>> Chengwen Feng (3):
>>    net/bonding: support private dump ops
>>    net/bonding: support dump LACP info
>>    net/bonding: use dump API to impl show bonding cmd
>>
>> ---
>> v2:
>> * address Min Hu's comment
>> * use rte_eth_dev_priv_dump API to implement testpmd show bonding
>>    command.
>>
>>   .../link_bonding_poll_mode_drv_lib.rst        |  13 +-
>>   drivers/net/bonding/bonding_testpmd.c         | 281 +-----------------
>>   drivers/net/bonding/rte_eth_bond_pmd.c        | 244 ++++++++++++++-
>>   3 files changed, 249 insertions(+), 289 deletions(-)
>>
>
> .