Re: [dpdk-dev] [PATCH v3 0/3] ethdev: add generic L2/L3 tunnel encapsulation actions

[Ferruh Yigit <ferruh.yigit@intel.com>]

On 10/7/2018 1:57 PM, Ori Kam wrote:
> This series implement the generic L2/L3 tunnel encapsulation actions
> and is based on rfc [1] "add generic L2/L3 tunnel encapsulation actions"
> 
> Currenlty the encap/decap actions only support encapsulation
> of VXLAN and NVGRE L2 packets (L2 encapsulation is where
> the inner packet has a valid Ethernet header, while L3 encapsulation
> is where the inner packet doesn't have the Ethernet header).
> In addtion the parameter to to the encap action is a list of rte items,
> this results in 2 extra translation, between the application to the action
> and from the action to the NIC. This results in negetive impact on the
> insertion performance.
>     
> Looking forward there are going to be a need to support many more tunnel
> encapsulations. For example MPLSoGRE, MPLSoUDP.
> Adding the new encapsulation will result in duplication of code.
> For example the code for handling NVGRE and VXLAN are exactly the same,
> and each new tunnel will have the same exact structure.
>     
> This series introduce a generic encapsulation for L2 tunnel types, and
> generic encapsulation for L3 tunnel types. In addtion the new
> encapsulations commands are using raw buffer inorder to save the
> converstion time, both for the application and the PMD.
> 
> [1]https://mails.dpdk.org/archives/dev/2018-August/109944.html
> 
> v3:
>  * rebase on tip.
> 
> v2:
>  * add missing decap_l3 structure.
>  * fix typo.
> 
> 
> Ori Kam (3):
>   ethdev: add generic L2/L3 tunnel encapsulation actions
>   app/testpmd: convert testpmd encap commands to new API
>   ethdev: remove vxlan and nvgre encapsulation commands

Reminder of this patchset, any reviews welcome.