From: yufengmx <yufengx.mo@intel.com>
To: dts@dpdk.org
Cc: yufengmx <yufengx.mo@intel.com>
Subject: [dts] [PATCH V3][testpmd/stacked_bonded]: test plan for testpmd stacked bonded
Date: Tue, 26 Feb 2019 15:23:15 +0800 [thread overview]
Message-ID: <1551165796-98914-1-git-send-email-yufengx.mo@intel.com> (raw)
stacked bonded mechanism allow a bonded port to be added to another bonded port.
v3:
- remove trailing whitespace.
- change command of setting port up/down
yufengmx (1):
[testpmd/stacked_bonded]: test plan for testpmd stacked bonded
test_plans/pmd_stacked_bonded_test_plan.rst | 408 ++++++++++++++++++++++++++++
1 file changed, 408 insertions(+)
create mode 100644 test_plans/pmd_stacked_bonded_test_plan.rst
--
1.9.3
next reply other threads:[~2019-02-26 7:20 UTC|newest]
Thread overview: 3+ messages / expand[flat|nested] mbox.gz Atom feed top
2019-02-26 7:23 yufengmx [this message]
2019-02-26 7:23 ` yufengmx
2019-02-28 10:30 ` Tu, Lijuan
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